Comfortech | Marathon MM
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Marathon MM

Marathon MM

  • Temperature measurement range: -40º to 3000ºC/-40º to 5432ºF
  • High-resolution optics up to 300:1
  • Precision Variable Focus
  • Real-time video monitoring and recording capability
  • Integrated through-the-lens and either video or laser sighting
  • Stainless steel housing
  • Easy-to-use interface

Product Description

The new Marathon MM Series platform, which covers a temperature range of minus 40 to 3000°C (minus 40 to 5432°F), consists of six IR temperature sensor models, each with a specific measurement wavelength and temperature range appropriate for either low- (minus 40 to 800°C / minus 40 to 1472°F), medium- (250 to 1100°C / 482 to 2012°F), or high-temperature (300 to 3000°C / 572 to 3273°F) production monitoring.

The Marathon MM now features Precision Variable Focus that allows fast, easy and accurate adjustment of the focus of measurement targets, either by push-button at the rear of the instrument or remotely via an RS232/RS485 PC connection, where adjustments can be seen real-time through video. Sensors with variable focus option can be configured according to each application requirements reducing the installation time and chance for incorrect installation.

To meet the needs of a many industries and a wide range of applications, Raytek offers five types of MM sensors:



Temperature Range

Spectral Response

Response Time (95% response)


 -40°C to 800°C
(-40°F to 1472°F)

8 – 14 µm

120 ms


250°C to 1650°C
(482°F to 3002°F)
5 µm
60 ms


 450°C to 2250°C
(842°F to 4082°F)

5 µm
60 ms


 250°C to 1100°C
(482°F to 2012°F)

 3.9 µm

120 ms


 100°C to 600°C
(212°F to 1112°F)

 2.3 µm

20 ms


 300°C to 1100°C
(572°F to 2012°F)

 1.6 µm

2 ms


450°C to 2250°C
(842°F to 4082°F)
1.6 µm

2 ms


450°C to 1740°C
(842°F to 2732°F

1 µm

2 ms


650°C to 3000°C
(1202°F to 5432°F)

 1 µm

2 ms

All sensors feature identical installation hardware and include Raytek DataTemp Multidrop software to enable easy and consistent installation, configuration and data capture across the full breadth of an application:

  • steel and metals processing (foundry/forging operations & heat treating)
  • glass bending, forming, tempering, annealing, and sealing
  • paper processing (ink drying/curing & lamination)
  • plastics processing and thermoforming; and semiconductor processing
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